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Intel Xeon W3570 - AT80601000918AB (BX80601W3570) information

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Type:CPU Manufacturer:Intel
family:Xeon microprocessors:Xeon 3500
Type CPU / Microprocessor
Market segment Server
Family Intel Xeon 3500
Model number    W3570
CPU part numbers
  • AT80601000918AB is an OEM/tray microprocessor
  • BX80601W3570 is a boxed microprocessor
Frequency    3200 MHz
Turbo frequency 3467 MHz
Bus speed    6.4 GT/s QPI (3200 MHz)
Clock multiplier    24
Package 1366-land Flip-Chip Land Grid Array (FC-LGA8)
Socket Socket 1366 / B / LGA1366
Size 1.77" x 1.67" / 4.5cm x 4.25cm
Introduction date Mar 29, 2009
End-of-Life date Last order date is September 27, 2013
Last shipment date for tray processors is September 5, 2014
Price at introduction $999
S-spec numbers
  ES/QS processors Production processors
Part number Q1DV Q1HJ SLBES
AT80601000918AB + + +
Architecture / Microarchitecture
Microarchitecture Nehalem
Platform Tylersburg-WS
Processor core    Nehalem-WS
Core steppings    C0 (Q1DV)
D0 (Q1HJ, SLBES)
CPUID 106A5 (SLBES)
Manufacturing process 0.045 micron
731 million transistors
Die size 263mm2
Data width 64 bit
The number of cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size    4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size    4 x 256 KB 8-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 24 GB
Multiprocessing Uniprocessor
Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4   
  • EM64T / Extended Memory 64 technology / Intel 64   
  • NX / XD / Execute disable bit   
  • HT / Hyper-Threading technology   
  • VT-x / Virtualization technology   
  • TBT / Turbo Boost technology   
Low power features
  • Thread C1/C1E, C3 and C6 states
  • Core C1/C1E, C3 and C6 states
  • Package C1/C1E, C3 and C6 states
  • Enhanced SpeedStep technology   
Integrated peripherals / components
Integrated graphics None
Memory controller The number of controllers: 1
Memory channels: 3
Supported memory: DDR3-800, DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 32
ECC supported: Yes
Other peripherals Quick Path Interconnect (1 link)
Electrical / Thermal parameters
V core    0.8V - 1.375V
Minimum/Maximum operating temperature    5°C - 67.9°C
Minimum/Maximum power dissipation    12 Watt (TDP in C6 state) / 224.42 Watt
Thermal Design Power    130 Watt


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